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MH310/MH310DH/310DL 3D SPI Machine Original and Technology for Accurate Solder Paste Inspection in Industrial SMT Settings

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    Buy cheap MH310/MH310DH/310DL 3D SPI Machine Original and Technology for Accurate Solder Paste Inspection in Industrial SMT Settings from wholesalers
     
    Buy cheap MH310/MH310DH/310DL 3D SPI Machine Original and Technology for Accurate Solder Paste Inspection in Industrial SMT Settings from wholesalers
    • Buy cheap MH310/MH310DH/310DL 3D SPI Machine Original and Technology for Accurate Solder Paste Inspection in Industrial SMT Settings from wholesalers

    MH310/MH310DH/310DL 3D SPI Machine Original and Technology for Accurate Solder Paste Inspection in Industrial SMT Settings

    Ask Lasest Price
    Brand Name : Minghao
    Model Number : MH310/MH310DH/310DL
    Price : USD
    Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram, Paypal
    Supply Ability : 10 units
    Delivery Time : 1 to 5 working days
    • Product Details
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    MH310/MH310DH/310DL 3D SPI Machine Original and Technology for Accurate Solder Paste Inspection in Industrial SMT Settings

    Product Description: MH310 Series 3D Solder Paste Inspection (SPI) Machine

    Manufacturer: Shenzhen Minghao Vision Technology Co., Ltd.

    The MH310 Series is a high-precision, 3D optical inspection system designed for real-time detection of solder paste defects in SMT (Surface Mount Technology) production lines. Utilizing phase modulation contour measurement (PMP) technology, it ensures micron-level accuracy (0.37µm resolution) while maintaining high-speed performance. The system supports closed-loop feedback with printers, SPC data analysis, and multi-machine interoperability for Industry 4.0 smart manufacturing.

    Key Features & Advantages

    FeatureBenefit
    Phase Modulation Contour (PMP) TechnologyAchieves 3D measurement with 0.37µm resolution, detecting defects like insufficient/excessive solder, misalignment, and bridging.
    Multi-Head ImagingSimultaneous multi-angle inspection improves speed vs. traditional single-head SPI.
    Far-Center Lens Static CompensationEliminates errors caused by FPC (flexible PCB) warping without Z-axis adjustment.
    Printer Closed-Loop ControlAutomatically sends stencil cleaning/alignment commands to printers to improve yield.
    SPC & MES IntegrationReal-time statistical process control (SPC) and compatibility with factory MES systems.
    BadMark SharingSkips defective boards in mounters, boosting efficiency.

    Technical Specifications (MH310/MH310DH/MH310DL Models)

    ParameterMH310MH310DHMH310DL
    Inspection Area50×50mm to 510×460mm50×50mm to 510×600mm50×50mm to 1200×460mm
    Thickness Range0.5mm–6mm0.5mm–6mm0.5mm–6mm
    Component HeightTop/Bottom: ±10mmTop: +10mm, Bottom: +40mmTop: +40mm, Bottom: +40mm
    Light SourceRGB-W 4-color integral lightCustomizable multi-directional lightingHigh-speed industrial camera
    Detection SpeedUp to 900Kx (customizable)Optimized for dual-head configurationsLarge-area scanning

    Applications

    Post-Printing Inspection: Installed after solder paste printers in SMT lines.

    Defect Types: Measures volume, height, misalignment, bridging, and solder splatter.

    Industry 4.0: Supports data traceability, multi-machine control (1 operator:4 machines), and AI-driven analytics.

    Certifications & Compliance

    Patents for PMP technology, software copyrights, and ISO quality management certifications.

    Target Industries: PCB assembly, automotive electronics, consumer electronics, and medical device manufacturing.

    Quality MH310/MH310DH/310DL 3D SPI Machine Original and Technology for Accurate Solder Paste Inspection in Industrial SMT Settings for sale
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