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MH550 3D AOI AI-Powered Solder Component Inspection for Industrial SMT Lines – Affordable Machine

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    Buy cheap MH550 3D AOI AI-Powered Solder Component Inspection for Industrial SMT Lines – Affordable Machine from wholesalers
     
    Buy cheap MH550 3D AOI AI-Powered Solder Component Inspection for Industrial SMT Lines – Affordable Machine from wholesalers
    • Buy cheap MH550 3D AOI AI-Powered Solder Component Inspection for Industrial SMT Lines – Affordable Machine from wholesalers

    MH550 3D AOI AI-Powered Solder Component Inspection for Industrial SMT Lines – Affordable Machine

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    Brand Name : Minghao
    Model Number : MH550/MH550DH/MH550DL
    Price : USD
    Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram, Paypal
    Supply Ability : 10 units
    Delivery Time : 30 to 40 working days
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    MH550 3D AOI AI-Powered Solder Component Inspection for Industrial SMT Lines – Affordable Machine

    Product Description: MH550/MH550DH/MH550DL In-line PCBA 3D Optical Inspection Equipment

    Manufacturer: Shenzhen Minghao Vision Technology Co., LTD

    Overview

    The MH550 series is an advanced 3D optical inspection system designed for high-precision detection of solder defects and component anomalies in PCBA (Printed Circuit Board Assembly) production lines. Leveraging structured light imaging and deep learning algorithms, it delivers sub-micron measurement accuracy (≤1µm repeatability) for superior defect identification with minimal false alarms.


    Key Features

    CategoryDescription
    Technology3D structured light imaging + deep neural networks (DNN) for intelligent defect classification.
    Detection ScopeComponents: Missing, misaligned, flipped, skewed, damaged. Solder: Insufficient/excessive solder, bridging, voids, cold joints, tin beads (≥120µm).
    Speed & Efficiency0.55 sec/FOV; supports mixed-board production with automatic program switching.
    Imaging Resolution10µm/15µm (FOV: 40×30mm/60×45mm); RGB+W light source + 4-direction structured light.
    Data & ConnectivityBarcode/QR code recognition, SPC analytics, MES integration, and remote monitoring.
    Hardware12MP high-speed camera, servo-driven gear mechanism, NVIDIA GPU acceleration.
    CustomizationConfigurable for PCB sizes: 50×50mm to 1200×460mm; thickness: 0.5–6mm.

    Technical Specifications

    ModelMH550MH550DHMH550DL
    PCB Size50×50mm – 510×460mm50×50mm – 510×600mm50×50mm – 1200×460mm
    Component HeightTop/Bottom: 40mmTop/Bottom: 40mmTop/Bottom: 40mm
    Resolution10µm @ 40×30mm FOV15µm @ 60×45mm FOV10µm/15µm configurable
    Power2KVA (AC220V)2.5KVA (AC220V)2.5KVA (AC220V)
    Weight~880kg~1100kg~1100kg

    Core Advantages

    Ultra-High Precision

    1µm repeatability with dynamic adaptive calibration.Multi-angle projection (4/8-direction) eliminates shadows and distortions.

    AI-Driven Efficiency

    One-click programming: Auto-detection of trained components/solder joints.SPC alarms and real-time data export for traceability.

    Robust Hardware

    High-rigidity structure reduces vibration during high-speed operation.GPU-accelerated algorithms (CUDA, OpenMP) for rapid 3reconstruction.

    Versatile Applications

    Compatible with pre-/post-reflow inspection in SMT lines. Supports bare boards and assembled devices.

    Quality MH550 3D AOI AI-Powered Solder Component Inspection for Industrial SMT Lines – Affordable Machine for sale
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